Slurry containment device for polishing semiconductor wafers
US5299393A · kind A · utility
27Cited by
12References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 21, 1992 |
| Grant date | Apr 5, 1994 |
| Priority date | — |
| Expiry date | Jul 21, 2012 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B57/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Liquid abrasive slurry for chemical-mechanical polishing of semiconductor wafers is held on a rotating polish table by a containment device having two continuous circular bonded strips of differing flexibilities. A releasable clamp seals the entire length of the more flexible strip to the table periphery.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.