Fabrication of printed circuit boards using conducting polymer
US5300208A · kind A · utility
65Cited by
11References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 14, 1989 |
| Grant date | Apr 5, 1994 |
| Priority date | — |
| Expiry date | Aug 14, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0329
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process for fabricating a printed circuit board concerns the use of a soluble, air-stable conducting polymer applied to plated through holes, blind holes or vias or to a predetermined portion of the printed circuit board surface for selectively metal plating on the polymer without the necessity of either an electroless plating bath or the use of precious metal seeds. A preferred conducting polymer is polyaniline. A preferred metal plating is preferably copper or a noble metal such as palladium or silver.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.