Plasticized polyetherimide adhesive composition and usage
US5300812A · kind A · utility
31Cited by
3References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 9, 1992 |
| Grant date | Apr 5, 1994 |
| Priority date | — |
| Expiry date | Dec 9, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15165
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A plasticized polyetherimide, such as a blend of polyetherimide and a pentaerythritol tetrabenzoate ester, has been found useful as a low temperature laminating adhesive for making high density interconnect circuit arrays.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.