Via hole punch
US5303618A · kind A · utility
14Cited by
3References
15Claims
0Family size
Inventor
Key dates
| Filing date | Sep 8, 1992 |
| Grant date | Apr 19, 1994 |
| Priority date | — |
| Expiry date | Sep 8, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/943
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A punch die used to punch minute via holes in ceramic wafers used in integrated circuit construction is created by photoetching holes too small to be mechanically drilled into a pair of thin sheets that sandwich therebetween a thicker spacer slab having somewhat larger, mechanically drilled holes. A multiplicity of punch pins are then pressed into the three-layer sandwich and epoxied thereto to create an inexpensive a punch die which cooperates with a mechanically drilled die plate covered with a punch-pin receiving perforated skin, the holes in which being created in a similar photoetching process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.