Single step electrical/mechanical connection process for connecting I/O pins and creating multilayer structures
US5303862A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 31, 1992 |
| Grant date | Apr 19, 1994 |
| Priority date | — |
| Expiry date | Dec 31, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A single step electrical/mechanical connection process utilizes an adhesive layer (3 or 26) that is patterned on a substrate (1 or 21) to mechanically connect adjacent substrates in a multilayered structure (28) or to connect a pin (2) assembly to a device (5). In a preferred embodiment, the adhesive layer (3 or 26) and substrate (1 or 21) are made from materials which will undergo transesterification under heat and pressure to create a very strong bond therebetween. The adhesive layer (3 or 26) is positioned around and does not cover the solder (4) in the pin connector assembly or the alignment holes (24) in the molding/sheet (21), thereby allowing bonding metallurgy to make positive electrical connections between pins (2) and pads (6) and adjacent spheres (22) in a multilayered structure (28).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.