Processes depending on plasma discharges sustained in a helical resonator
US5304282A · kind A · utility
40Cited by
4References
18Claims
0Family size
Inventor
Key dates
| Filing date | Apr 17, 1991 |
| Grant date | Apr 19, 1994 |
| Priority date | — |
| Expiry date | Apr 17, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/32137
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Plasma etching and deposition is accomplished utilizing a helical resonator constructed with an inner diameter coil greater than 60 percent of the outer shield diameter. The diameter of the conductor used to form the coil is not critical and can be less than 40 percent of the winding pitch in some applications. These parameters permit helical resonator plasma sources to be more compact and economical, and facilitate improved uniformity for processing large substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.