Module for electronic package

US5306866A · kind A · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Harald Gruber · Herrenberg, DE
• Heinz G. Horbach · Gechingen, DE
• Gunther Kotzle · Nagold, DE
• Thomas Ludwig · Sindelfingen, DE
• Helmut Schettler · Waldenbuch, DE

Key dates

• Filing date: Apr 13, 1992
• Grant date: Apr 26, 1994
• Expiry date: Apr 13, 2012

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/09701
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A module containing an electronic package provides a housing for cooling and protecting the electronic package. A top metal shell and a bottom metal shell form a common cavity in which the package is embedded without touching the inner walls of the cavity. A flexible thermally conductive foil is fixed to each of the shells. The foil is adjustable to the surface of the package and is isolated from electrically conductive parts of the package. A cooling liquid fills the gaps between the metal shells and the foils. Flexible isolated circuit means connect the package to the outside of the housing, balancing means balance pressure and volume between the shells, and further means firmly hold together the housing.