Method of making semiconductor heterostructures of gallium arsenide on germanium
US5308444A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 28, 1993 |
| Grant date | May 3, 1994 |
| Priority date | — |
| Expiry date | May 28, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S148/169
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention is predicated upon the discovery by applicants that exposure of a Ge surface to arsenic produces a drastic change in the step structure of the Ge surface. Subsequent exposure to Ga and growth of GaAs produces three-dimensional growth and a high threading dislocation density at the GaAs/Ge interface. However exposure of the Ge surface to Ga does not substantially change the Ge step structure, and subsequent growth of GaAs is two-dimensional with little increase in threading dislocation density. Thus a high quality semiconductor heterostructure of gallium arsenide on germanium can be made by exposing a germanium surface in an environment substantially free of arsenic, depositing a layer of gallium on the surface and then growing a layer of gallium arsenide. The improved method can be employed to make a variety of optoelectronic devices such as light-emitting diodes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.