Fluorine-containing curable resin composition and use thereof
US5308888A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 22, 1993 |
| Grant date | May 3, 1994 |
| Priority date | — |
| Expiry date | Feb 22, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/034
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
According to the present invention, there is provided a resin composition which can provide an insulating resin having excellent heat resistance and flame retardance after curing and showing a low dielectric constant. A fluorine-containing photo-setting resin composition comprising a polymer containing fluorine or a fluorine-containing group represented by general formula [II]: ##STR1## wherein R.sup.1 and R.sup.2 are selected from the group consisting of H, F, CH.sub.3 and CF.sub.3 ; R.sup.3 and R.sup.4 are selected from the group consisting of CH.sub.2 and CF.sub.2 ; x and y show 0 to 4 and m shows 30 to 1000, and a photopolymerization initiator, which is a solid at ambient temperature, melts between 100.degree. and 150.degree. C., has a melt viscosity of not greater than 10.sup.6 poise and is photocurable.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.