Inventor · Kasai, JP

Hiroshi Hamana

18Patents
12h-index
29Co-inventors
78Inventor score

Filing activity: Feb 6, 1986 → Nov 9, 2015

Most-cited inventions

PatentTitleAreaCited byStatus
US9378969B2 Low temperature gas-phase carbon removal Electricity 509 Active
US8664127B2 Two silicon-containing precursors for gapfill enhancing dielectric liner Electricity 463 Active
US9153442B2 Processing systems and methods for halide scavenging Electricity 217 Active
US9023732B2 Processing systems and methods for halide scavenging Electricity 184 Active
US9093371B2 Processing systems and methods for halide scavenging Electricity 183 Active
US9184055B2 Processing systems and methods for halide scavenging Electricity 178 Active
US9449850B2 Processing systems and methods for halide scavenging Electricity 134 Active
US9659792B2 Processing systems and methods for halide scavenging Electricity 121 Active
US9704723B2 Processing systems and methods for halide scavenging Electricity 114 Active
US9991134B2 Processing systems and methods for halide scavenging Electricity 100 Active
US8365934B2 Synthetic resin cap Performing Operations; Transporting 12 Active
US4613657A Method for anionic homopolymerization of .alpha.-trifluoromethylacrylate Chemistry; Metallurgy 12 Expired
US8297458B2 Cap and container for improved sealing Performing Operations; Transporting 5 Active
US8975152B2 Methods of reducing substrate dislocation during gapfill processing Electricity 4 Active
US8476142B2 Preferential dielectric gapfill Electricity 2 Active
US5308888A Fluorine-containing curable resin composition and use thereof Electricity 1 Expired
US8012887B2 Precursor addition to silicon oxide CVD for improved low temperature gapfill Electricity 0 Active
US10533204B2 Method for amplifying a T cell receptor (TCR) cDNA Chemistry; Metallurgy 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.