Semiconductor device having particular power distribution interconnection arrangement
US5309021A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 15, 1992 |
| Grant date | May 3, 1994 |
| Priority date | — |
| Expiry date | Oct 15, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device according to the present invention has reduced inductance on a power supply line, a grounding line, and signal lines. In this invention, to reduce the length of the power supply connection and that of the grounding connection, a power supply metal post and a grounding metal post are respectively provided on a power supply lead of a semiconductor chip and grounding lead of the semiconductor chip perpendicular to the leads. The metal posts protrude from the resin encapsulating the chip and are connected to lands or a conductive circuit pattern on a printed circuit board. Furthermore, a planar conductor commonly connecting the power supply or grounding potentials is provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.