Process for producing printed wiring board
US5309632A · kind A · utility
38Cited by
7References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 2, 1992 |
| Grant date | May 10, 1994 |
| Priority date | — |
| Expiry date | Nov 2, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process for producing a printed wiring board characterized by forming a nickel layer by electroless plating and a copper layer formed thereon by electroless plating, or forming a copper undercoating layer before the nickel layer by electroless plating can produce printed circuit boards excellent in resistance to electrolytic corrosion and suitable for mounting parts in high density.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.