Techniques for assembling polishing pads for chemi-mechanical polishing of silicon wafers
US5310455A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 10, 1992 |
| Grant date | May 10, 1994 |
| Priority date | — |
| Expiry date | Jul 10, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1052
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A technique for mounting polishing pads to a platen in chemi-mechanical semiconductor wafer polishing apparatus is disclosed. A lower pad is mounted to the platen, and is trimmed to the size of the platen. An upper pad is mounted to the lower pad, and is sized so that an extreme outer edge portion of the upper pad extends beyond the trimmed outer edge of the lower pad. The outer edge portion of the upper pad is deformed downwardly, towards the lower pad. In this manner, polishing slurry is diverted from the pad-to-pad interface. Additionally, an integral annular lip can be formed on the front face of the upper pad, creating a reservoir for slurry to be retained on the face of the upper pad for enhancing residence time of the polishing slurry prior to the slurry washing over the face of the upper pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.