Mark Franklin
13Patents
7h-index
16Co-inventors
63Inventor score
Filing activity: Sep 5, 1975 → Sep 10, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5624304A | Techniques for assembling polishing pads for chemi-mechanical polishing of silicon wafers | Emerging Cross-Sectional Technologies | 90 | Expired |
| US5310455A | Techniques for assembling polishing pads for chemi-mechanical polishing of silicon wafers | Emerging Cross-Sectional Technologies | 71 | Expired |
| US5516400A | Techniques for assembling polishing pads for chemical-mechanical polishing of silicon wafers | Emerging Cross-Sectional Technologies | 68 | Expired |
| US5468296A | Apparatus for igniting low pressure inductively coupled plasma | Electricity | 54 | Expired |
| US6780759B2 | Method for multi-frequency bonding | Electricity | 51 | Expired |
| US5639519A | Method for igniting low pressure inductively coupled plasma | Electricity | 23 | Expired |
| US4039956A | Electronic indicator | Emerging Cross-Sectional Technologies | 14 | Expired |
| US6062163A | Plasma initiating assembly | Electricity | 7 | Expired |
| US7262900B2 | Utilizing a protective plug to maintain the integrity of the FTP shrink hinge | Performing Operations; Transporting | 3 | Expired |
| US11894261B2 | Silicon-on-insulator substrate including trap-rich layer and methods for making thereof | Electricity | 0 | Active |
| US11145537B2 | Silicon-on-insulator substrate including trap-rich layer and methods for making thereof | Electricity | 0 | Active |
| US7781311B2 | System and method for filling vias | Emerging Cross-Sectional Technologies | 0 | Active |
| US10323504B2 | Techniques for determining an angular offset between two objects | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.