Method for manufacturing high T.sub.c superconducting circuit elements with metallic substrate
US5310706A · kind A · utility
4Cited by
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10Claims
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Key dates
| Filing date | Jul 16, 1993 |
| Grant date | May 10, 1994 |
| Priority date | — |
| Expiry date | Jul 16, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S505/729
Abstract
A method for manufacturing a high Tc superconducting circuit elements is disclosed, which comprises the steps of preparing a single crystal conductive substrate of Sr.sub.2 RuO.sub.4 by a floating zone melting process; epitaxially growing on the (001)-surface of the Sr.sub.2 RuO.sub.4 substrate a high Tc copper oxide-based superconducting film with a thickness of 1 to 1000 nm; depositing metal pads onto said superconducting film to form electrical contacts; and applying a metal pad to the surface of the substrate to form an electrical contact.
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