Apparatus for manufacturing semiconductor device and method for manufacturing semiconductor device
US5314538A · kind A · utility
395Cited by
5References
3Claims
0Family size
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Key dates
| Filing date | Dec 22, 1992 |
| Grant date | May 24, 1994 |
| Priority date | — |
| Expiry date | Dec 22, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/141
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus and method for manufacturing a semiconductor device capable of forming a single layer film or a multilayer film of improved quality by continuously processing without exposure of the wafer to the ambient air. The apparatus includes a film forming section having a gas dispersion unit for supplying reaction gas, a processing section for processing the formed film and a wafer holder for holding a wafer facing the gas dispersion unit or the processing section. The wafer holder moves the wafer between the film forming section and the processing section while heating the wafer by a heating element contained therein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.