Sputtering apparatus with a magnet array having a geometry for a specified target erosion profile
US5314597A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Mar 20, 1992 |
| Grant date | May 24, 1994 |
| Priority date | — |
| Expiry date | Mar 20, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3455
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A rotatable magnet configuration for use in a magnetron sputtering system for obtaining a desired sputter target erosion profile and for obtaining a sputtered film on a substrate having a desired film characteristic, such as uniformity of thickness, and a method of designing such a magnet configuration are disclosed. The disclosed design and method compensate for the discrepancy between the between the actual position of the magnet and the "effective" position of the magnet as measured by a static erosion profile obtained holding the magnet stationary. The method shown describes how to adjust the actual shape of the magnet to obtain a desired effective shape that will produce a predetermined erosion profile in the sputter target. In addition, the disclosure describes how to determine an optimal erosion profile to produce a sputtered film having a desired characteristic.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.