Apparatus for heat-treating wafer by light-irradiation and device for measuring temperature of substrate used in such apparatus
US5315092A · kind A · utility
563Cited by
3References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 11, 1991 |
| Grant date | May 24, 1994 |
| Priority date | — |
| Expiry date | Oct 11, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67115
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A temperature measuring device for measuring the temperature of a wafer heated by light irradiation includes: a sheath thermocouple for detecting the temperature of a wafer to be measured by contacting the wafer to be measured; and a covering member for covering the surface of the sheath thermocouple. The surface of the covering member is flat in a predetermined region, and the part in the region can plane-contact the surface of the wafer. Thus, the temperature of the wafer can be measured accurately and in a stable manner, and the wafer surface is free from contamination with adhesives or the metal of the thermocouple.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.