Electronic package with stress relief channel
US5315155A · kind A · utility
47Cited by
28References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 13, 1992 |
| Grant date | May 24, 1994 |
| Priority date | — |
| Expiry date | Jul 13, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16195
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
There is provided an electronic package assembly having a leadframe and buffer bonded to a metallic base. To reduce the stress generated by the coefficient of thermal expansion mismatch, the buffer is mounted on a pedestal. The cross sectional area of the pedestal is less than that of the buffer, such that the at least a portion of the buffer overhangs the pedestal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.