Corrosion inhibition with CU-BTA
US5316573A · kind A · utility
18Cited by
14References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 12, 1992 |
| Grant date | May 31, 1994 |
| Priority date | — |
| Expiry date | Mar 12, 2012 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23F11/10
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A corrosion protecting film layer is formed on a non-passivating non-noble metal, such as cobalt, by placing the metal in a dilute solution of Cu.sup.+2 ions and benzotriazole (1 H-BTA). Exposure of the metal to a solution containing Cu.sup.+2 and 1 H-BTA results in a spontaneous interaction of Cu.sup.+2 and the metal to produce a film layer of Cu(I) BTA on the metal surface to create a permanent corrosion protection for the metal. A borate buffer, such as boric acid and a borate, can be added to the solution to adjust the pH of the solution to be in the range between 8 and 9.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.