Patent · US Expired

Semiconductor package having an exposed die surface

US5319242A · kind A · utility

31Cited by

5References

11Claims

0Family size

Assignee

Motorola, Inc. · US

Inventors

Francis J. Carney · Mesa, US
Edward M. Majors · Plano, US
James H. Knapp · Chandler, US

Key dates

Filing date	Mar 18, 1992
Grant date	Jun 7, 1994
Priority date	—
Expiry date	Mar 18, 2012

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/10158
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor package includes a die having a first surface including a plurality of bond pads disposed thereon and a second surface. Inner lead portions of a TAB leadframe are coupled to the bond pads and outer lead portions electrically coupled to the inner lead portions extend therefrom. An encapsulation is disposed on the first surface of the die including the bond pads having the inner lead portions of the TAB leadframe bonded thereto. Encapsulation is also disposed about the sides of the die. The second surface of the die remains exposed. This allows for a relatively thin package having superior thermal dissipation properties.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.