James H. Knapp
31Patents
18h-index
42Co-inventors
77Inventor score
Filing activity: May 23, 1988 → Dec 8, 2003
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6300679A | Flexible substrate for packaging a semiconductor component | Electricity | 163 | Expired |
| US6093972A | Microelectronic package including a polymer encapsulated die | Electricity | 93 | Expired |
| US5895229A | Microelectronic package including a polymer encapsulated die, and method for forming same | Electricity | 91 | Expired |
| US5768456A | Optoelectronic package including photonic device mounted in flexible substrate | Physics | 88 | Expired |
| US5933558A | Optoelectronic device and method of assembly | Physics | 75 | Expired |
| US5973337A | Ball grid device with optically transmissive coating | Electricity | 56 | Expired |
| US5468910A | Semiconductor device package and method of making | Electricity | 48 | Expired |
| US5883996A | Electronic component for aligning a light transmitting structure | Physics | 45 | Expired |
| US5834062A | Material transfer apparatus and method of using the same | Emerging Cross-Sectional Technologies | 44 | Expired |
| US5118271A | Apparatus for encapsulating a semiconductor device | Performing Operations; Transporting | 38 | Expired |
| US7227240B2 | Semiconductor device with wire bond inductor and method | Electricity | 33 | Expired |
| US6116791A | Optical coupler and method for coupling an optical fiber to an optoelectric device | Physics | 32 | Expired |
| US5319242A | Semiconductor package having an exposed die surface | Electricity | 31 | Expired |
| US5659648A | Polyimide optical waveguide having electrical conductivity | Physics | 26 | Expired |
| US5761364A | Optical waveguide | Physics | 25 | Expired |
| US5928595A | Method of manufacturing a semiconductor component | Performing Operations; Transporting | 24 | Expired |
| US6677672B2 | Structure and method of forming a multiple leadframe semiconductor device | Electricity | 20 | Expired |
| US6713317B2 | Semiconductor device and laminated leadframe package | Electricity | 19 | Expired |
| US6081031A | Semiconductor package consisting of multiple conductive layers | Emerging Cross-Sectional Technologies | 18 | Expired |
| US6835580B1 | Direct chip attach structure and method | Electricity | 15 | Expired |
| US4877482A | Nitride removal method | Chemistry; Metallurgy | 10 | Expired |
| US5900669A | Semiconductor component | Emerging Cross-Sectional Technologies | 9 | Expired |
| US5637264A | Method of fabricating an optical waveguide | Performing Operations; Transporting | 8 | Expired |
| US6833290B2 | Structure and method of forming a multiple leadframe semiconductor device | Electricity | 8 | Expired |
| US4975146A | Plasma removal of unwanted material | Chemistry; Metallurgy | 8 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.