Surface modified copper alloys
US5320689A · kind A · utility
10Cited by
17References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 1, 1993 |
| Grant date | Jun 14, 1994 |
| Priority date | — |
| Expiry date | Mar 1, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12903
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
There is provided a composite copper alloy having a copper alloy core and a modified surface layer containing a nitride or carbide film. Alternatively, the modified surface layer may contain a carbo-nitride film. The alloy is formed by reacting a copper alloy with nitrogen, carbon or a nitrogen/carbon mixture at elevated temperatures. The resultant surface layer improves the tribological and mechanical properties of the alloy while maintaining useful electrical conductivity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.