Probe apparatus and method of alignment for the same
US5321352A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jul 31, 1992 |
| Grant date | Jun 14, 1994 |
| Priority date | — |
| Expiry date | Jul 31, 2012 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2887
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A probe apparatus for measuring electrical characteristics of chips arranged on a wafer comprises a probe card having probe needles and a rotary chuck for supporting the wafer. The chuck is supported on an XY stage. A stationary alignment bridge is provided with a stationary camera and a capacitance sensor. The stage is provided with a movable camera. A transparent plate on which a target is formed is attached to the chuck. The target and its peripheral portion are formed of transparent thin films. The target is used for positioning and focusing of the cameras. The thin films are used for height detection by use of the capacitance sensor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.