Process for producing coaxial conductor interconnection wiring board
US5323534A · kind A · utility
9Cited by
5References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 8, 1993 |
| Grant date | Jun 28, 1994 |
| Priority date | — |
| Expiry date | Mar 8, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49162
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A coaxial conductor interconnection wiring board characterized by having at least one inner wall metallized conductive hole for connecting a conductive shield of coaxial conductor to a ground layer, or having connection metal layers for connecting ground layers or connecting the conductive shield to a ground layer, and an inner wall metallized conductive hole for connecting a central signal conductor of coaxial conductor to other circuits, is excellent in preventing crosstalk noise and shielding effect.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.