Composite transversely plastic interconnect for microchip carrier
US5324569A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 26, 1993 |
| Grant date | Jun 28, 1994 |
| Priority date | — |
| Expiry date | Feb 26, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2991
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A composite transversely plastic interconnect for a microcarrier produces a carrier-to-substrate bond having low electrical resistance and high mechanical strength, significant bond height to mediate TCE mismatch between dissimilar carrier and substrate materials, and sufficient gap between the carrier and the substrate to permit effective post solder cleaning of the interconnect. A contact array consisting of solder balls is placed directly onto either of a carrier or a substrate interconnect surface with a stencil positioned to the chosen interconnect surface. The solder balls may have a selected melting temperature. Additionally, the solder balls may have a metallic coating, such as nickel or copper, or molten solder. The carrier and substrate are joined by mating an interconnect surface of each and applying heat. Solder paste may be applied to one of the interconnect surfaces to add additional height to the joint and compensate for lack of coplanarity between the carrier and the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.