Daniel J. Miller
12Patents
9h-index
22Co-inventors
72Inventor score
Filing activity: May 29, 1987 → May 29, 2012
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5324569A | Composite transversely plastic interconnect for microchip carrier | Emerging Cross-Sectional Technologies | 91 | Expired |
| US5409157A | Composite transversely plastic interconnect for microchip carrier | Emerging Cross-Sectional Technologies | 69 | Expired |
| US5199165A | Heat pipe-electrical interconnect integration method for chip modules | Emerging Cross-Sectional Technologies | 63 | Expired |
| US5426405A | Family of different-sized demountable hybrid assemblies with microwave-bandwidth interconnects | Electricity | 46 | Expired |
| US5161090A | Heat pipe-electrical interconnect integration for chip modules | Electricity | 35 | Expired |
| US5221421A | Controlled etching process for forming fine-geometry circuit lines on a substrate | Emerging Cross-Sectional Technologies | 17 | Expired |
| US6242075A | Planar multilayer ceramic structures with near surface channels | Emerging Cross-Sectional Technologies | 13 | Expired |
| US5045526A | Making insulated superconductor wire | Emerging Cross-Sectional Technologies | 11 | Expired |
| US8330556B2 | Passivation layers in acoustic resonators | Emerging Cross-Sectional Technologies | 11 | Active |
| US6732905B2 | Vented cavity, hermetic solder seal | Performing Operations; Transporting | 2 | Expired |
| US8881639B2 | Hybrid body armor | Mechanical Engineering; Lighting; Heating | 1 | Active |
| US6958446B2 | Compliant and hermetic solder seal | Physics | 1 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.