Metal electronic package with reduced seal width
US5324888A · kind A · utility
22Cited by
11References
34Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 13, 1992 |
| Grant date | Jun 28, 1994 |
| Priority date | — |
| Expiry date | Oct 13, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
There is provided an electronic package where the package components define a cavity. A semiconductor device and a portion of a leadframe occupy part of the cavity. Substantially the remainder of the cavity is filled with a compliant polymer, such as a silicone gel. Since the cavity is no longer susceptible to gross leak failure, the seal width of adhesives used to assemble the package may be reduced, thereby increasing the area available for mounting the semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.