Undercut membrane mask for high energy photon patterning
US5326426A · kind A · utility
Inventors
Key dates
| Filing date | Nov 14, 1991 |
| Grant date | Jul 5, 1994 |
| Priority date | — |
| Expiry date | Nov 14, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24322
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A mask for use with high energy radiation sources in precision projection processing by excimer lasers, for example, is described. The mask comprises a suitable substrate, such as silicon, upon which a multilayer dielectric stack is formed which acts as a reflective coating for the impinging excimer laser radiation, minimizing energy absorption by the mask substrate. The mask transparent areas are defined by the through-holes in the mask. The through-holes are formed with a conically undercut edge profile to define a thin object plane for the mask and minimize scattering of the radiation from the through-hole sidewalls. A method for fabricating the mask is also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.