Barbituric acid-modified bismaleimide with diamine and polyisocyanate-modified epoxy resin
US5326794A · kind A · utility
8Cited by
4References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 10, 1992 |
| Grant date | Jul 5, 1994 |
| Priority date | — |
| Expiry date | Jul 10, 2012 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L79/085
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A process for manufacturing a high glass transition temperature printed circuit board comprising blending a modified bismaleimide resin into a modified epoxy resin is disclosed. Particularly the material is manufactured by blending a bismaleimide resin reacted with barbituric acid and its derivative thereof and an epoxy resin with an oxazolidone ring resulting from the reaction of a polyisocyanate and an epoxy resin modified with a secondary diamine and followed by curing. The resultant product has a high glass transition temperature, a good adhesion, flame retardancy, and a low bromine content.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.