Composite lead frame with connected inner and outer leads
US5326990A · kind A · utility
5Cited by
2References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 9, 1992 |
| Grant date | Jul 5, 1994 |
| Priority date | — |
| Expiry date | Sep 9, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49121
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An outer lead of a metal lead frame is connected to an inner lead of a flexible lead-patterned substrate via a Au-Sn alloy layer. The Au-Sn alloy layer contains Au of 10 to 40 weight %. An inner lead of a metal lead frame is connected to a patterned lead of a flexible lead-patterned substrate by a heating tool. The inner lead is coated on bottom and side surfaces of its tip portion. The bottom surface faces the patterned lead.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.