Processing vessel for a wafer washing system
US5327921A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Mar 4, 1993 |
| Grant date | Jul 12, 1994 |
| Priority date | — |
| Expiry date | Mar 4, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A processing vessel suitable for use with a washing system intended to wash a plurality of wafers. The processing vessel includes a washing solution supply source, a circulation pump, a filter, a main vessel portion provided with inlets in the bottom thereof, a boat for holding the plurality of wafers in the center area of the main vessel portion and a flow control assembly arranged between the inlets and the wafers. The flow control assembly includes a scattering plate for scattering washing solution, which is introduced into the main vessel portion through the inlets, in the horizontal direction, and guiding passages through which the washing solution introduced through the inlets is made to have a substantially laminar flow and is guided into the center area of the main vessel portion. The guiding passages are formed by intervals between side plates and the scattering plate and by a plurality of apertures in the scattering plate. These guiding passages enable most of the washing solution to positively flow through spaces between the adjacent wafers. The flow control assembly also include a flow rate reducing section for reducing the amount of the washing solution which flows alo…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.