Functional fluid additives for acid copper electroplating baths
US5328589A · kind A · utility
71Cited by
7References
21Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 23, 1992 |
| Grant date | Jul 12, 1994 |
| Priority date | — |
| Expiry date | Dec 23, 2012 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D3/38
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A process and composition for high acid/low metal copper electroplating baths with improved leveling, adhesion, ductility and throwing power. The bath includes effective amounts of a functional fluid having at least one ether group derived from an alcohol epoxy or a bisphenol A and containing ethoxy and propoxy functionalities.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.