Enthone-OMI, Inc.
34Patents
0Active
34Granted
38Portfolio score
Filing activity: Jul 23, 1990 → Nov 11, 1998
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6261637A | Use of palladium immersion deposition to selectively initiate electroless plating on Ti and W alloys for wafer fabrication | Electricity | 240 | Expired |
| US6024856A | Copper metallization of silicon wafers using insoluble anodes | Chemistry; Metallurgy | 85 | Expired |
| US5328589A | Functional fluid additives for acid copper electroplating baths | Chemistry; Metallurgy | 71 | Expired |
| US5368715A | Method and system for controlling plating bath parameters | Chemistry; Metallurgy | 34 | Expired |
| US5435898A | Alkaline zinc and zinc alloy electroplating baths and processes | Chemistry; Metallurgy | 23 | Expired |
| US5169514A | Plating compositions and processes | Chemistry; Metallurgy | 20 | Expired |
| US5437887A | Method of preparing aluminum memory disks | Emerging Cross-Sectional Technologies | 19 | Expired |
| US5182006A | Zincate solutions for treatment of aluminum and aluminum alloys | Chemistry; Metallurgy | 16 | Expired |
| US6146702A | Electroless nickel cobalt phosphorous composition and plating process | Chemistry; Metallurgy | 14 | Expired |
| US5730854A | Alkoxylated dimercaptans as copper additives and de-polarizing additives | Chemistry; Metallurgy | 14 | Expired |
| US5108552A | Electroplating process | Chemistry; Metallurgy | 12 | Expired |
| US5358602A | Method for manufacture of printed circuit boards | Emerging Cross-Sectional Technologies | 11 | Expired |
| US5376248A | Direct metallization process | Electricity | 11 | Expired |
| US6080447A | Low etch alkaline zincate composition and process for zincating aluminum | Chemistry; Metallurgy | 11 | Expired |
| US6183622A | Ductility additives for electrorefining and electrowinning | Chemistry; Metallurgy | 11 | Expired |
| US5192461A | Aqueous degreasing solution having high free alkalinity | Chemistry; Metallurgy | 11 | Expired |
| US6013203A | Coatings for EMI/RFI shielding | Electricity | 10 | Expired |
| US5998237A | Method for adding layers to a PWB which yields high levels of copper to dielectric adhesion | Electricity | 9 | Expired |
| US5578187A | Plating process for electroless nickel on zinc die castings | Chemistry; Metallurgy | 8 | Expired |
| US5853556A | Use of hydroxy carboxylic acids as ductilizers for electroplating nickel-tungsten alloys | Chemistry; Metallurgy | 8 | Expired |
| US5928435A | Method for removing organic coatings from substrates using carboxylic acids, organic solvents, and corrosion inhibitors | Chemistry; Metallurgy | 8 | Expired |
| US5061351A | Bright tin electrodeposition composition | Chemistry; Metallurgy | 7 | Expired |
| US6045682A | Ductility agents for nickel-tungsten alloys | Chemistry; Metallurgy | 7 | Expired |
| US5486272A | Electroplating method and apparatus | Chemistry; Metallurgy | 6 | Expired |
| US5525206A | Brightening additive for tungsten alloy electroplate | Chemistry; Metallurgy | 6 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.