Semiconductor fabrication equipment
US5330577A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Oct 27, 1992 |
| Grant date | Jul 19, 1994 |
| Priority date | — |
| Expiry date | Oct 27, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S148/017
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A semiconductor fabrication apparatus for forming a film on a wafer by a CVD method provides for easy removal of the dust generated in a film-forming chamber without reducing the uptime/downtime ratio of the equipment. The apparatus includes one or more gas dispersing devices having gas releasing surfaces for releasing a reaction gas to form a film on a wafer; one or more wafer holders having wafer mounting surfaces opposed to the plane defined by the gas releasing surface; and one or more cleaners, each having a suction port and a brush connected to the suction port, provided opposing the gas releasing surface. Either the cleaner or the gas dispersing device is moved so that the brush contacts and traverses the gas releasing surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.