Alignment and exposure method
US5331371A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 4, 1993 |
| Grant date | Jul 19, 1994 |
| Priority date | — |
| Expiry date | Nov 4, 2013 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F9/70
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A semiconductor device manufacturing exposure method for exposing different portions of a semiconductor wafer with radiation in a step-and-repeat manner includes the steps of: placing the wafer on a wafer chuck; detecting a first mark of the wafer, whereby a wafer mark signal is produced; controlling a rotational position of the wafer chuck on the basis of the wafer mark signal; printing an image of a second mark of a mask on a portion of a photosensitive material layer provided on a portion of the wafer chuck outside the wafer; photoelectrically detecting the image of the second mark of the mask printed on the photosensitive layer, whereby a mask mark signal is produced; producing data necessary for control of movement of the wafer chuck through a stage, by using the mask mark signal; effecting step-and-repeat exposure of the different portions of the wafer by using a radiation beam while controlling the movement of the wafer chuck through the stage on the basis of the produced data; and blocking a portion of the radiation beam with use of a blocking member disposed between a source of the radiation beam and the wafer to prevent exposure of the photosensitive material layer during…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.