Automatic wafer lapping apparatus
US5333413A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Dec 15, 1992 |
| Grant date | Aug 2, 1994 |
| Priority date | — |
| Expiry date | Dec 15, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67778
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An automatic wafer lapping apparatus including: a lapping assembly consisting of an upper lapping plate, a lower lapping plate and wafer carriers; a loader assembly installed in the vicinity of the lapping assembly; an unloader assembly installed in the vicinity of the lapping assembly; and a robot having wafer holder member for holding a plurality of wafers and for transferring the wafers between the loader assembly and the unloader assembly and the lapping assembly, WHEREIN the wafer lapping assembly further includes a position sensor for detecting the position of the carriers and a device for cleaning the wafer holder, and the robot consists of a single-handed arm and the wafer holder supported at the fore end of the arm of the robot which can hold wafers one by one.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.