Ceramic via composition, multilayer ceramic circuit containing same, and process for using same
US5336444A · kind A · utility
9Cited by
15References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 29, 1992 |
| Grant date | Aug 9, 1994 |
| Priority date | — |
| Expiry date | May 29, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0306
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A novel metal filled via composition for use with ceramics. The via composition can be formulated to have a volume shrinkage approximating that of the ceramic material, and thus overcomes the problem of volume shrinkage mismatch between the via (particularly copper filled via) and ceramic upon sintering. The novel via composition exhibits enhanced adhesion to the ceramic. A sintering process by which shrinkage of the novel via composition is controlled and adhesion is improved is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.