Jon A. Casey
78Patents
15h-index
209Co-inventors
87Inventor score
Filing activity: May 1, 1986 → Dec 5, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5870823A | Method of forming a multilayer electronic packaging substrate with integral cooling channels | Emerging Cross-Sectional Technologies | 143 | Expired |
| US7276787B2 | Silicon chip carrier with conductive through-vias and method for fabricating same | Electricity | 90 | Expired |
| US5480503A | Process for producing circuitized layers and multilayer ceramic sub-laminates and composites thereof | Emerging Cross-Sectional Technologies | 89 | Expired |
| US4885038A | Method of making multilayered ceramic structures having an internal distribution of copper-based conductors | Electricity | 72 | Expired |
| US6262357A | Thermoelectric devices and methods for making the same | Electricity | 58 | Expired |
| US6121539A | Thermoelectric devices and methods for making the same | Electricity | 53 | Expired |
| US5541005A | Large ceramic article and method of manufacturing | Emerging Cross-Sectional Technologies | 49 | Expired |
| US5927193A | Process for via fill | Electricity | 29 | Expired |
| US5601672A | Method for making ceramic substrates from thin and thick ceramic greensheets | Emerging Cross-Sectional Technologies | 21 | Expired |
| US5135595A | Process for fabricating a low dielectric composite substrate | Electricity | 19 | Expired |
| US7015581B2 | Low-K dielectric material system for IC application | Electricity | 17 | Expired |
| US8202765B2 | Achieving mechanical and thermal stability in a multi-chip package | Electricity | 17 | Active |
| US5139851A | Low dielectric composite substrate | Emerging Cross-Sectional Technologies | 16 | Expired |
| US5139852A | Low dielectric composite substrate | Emerging Cross-Sectional Technologies | 16 | Expired |
| US6278049A | Thermoelectric devices and methods for making the same | Electricity | 16 | Expired |
| US8421217B2 | Achieving mechanical and thermal stability in a multi-chip package | Electricity | 15 | Active |
| US7452568B2 | Centrifugal method for filing high aspect ratio blind micro vias with powdered materials for circuit formation | Electricity | 12 | Active |
| US6402866B1 | Powdered metallic sheet method for deposition of substrate conductors | Emerging Cross-Sectional Technologies | 12 | Expired |
| US5468445A | Ceramic via composition, multilayer ceramic circuit containing same, and process for using same | Electricity | 10 | Expired |
| US5277725A | Process for fabricating a low dielectric composite substrate | Electricity | 10 | Expired |
| US6878616B1 | Low-k dielectric material system for IC application | Electricity | 9 | Expired |
| US5336444A | Ceramic via composition, multilayer ceramic circuit containing same, and process for using same | Electricity | 9 | Expired |
| US6015517A | Controlled porosity for ceramic contact sheets and setter tiles | Chemistry; Metallurgy | 8 | Expired |
| US5759669A | Apparatus and method for screening green sheet with via hole using porous backing material | Emerging Cross-Sectional Technologies | 8 | Expired |
| US5916374A | Optimized in-line mask cleaning system | Electricity | 8 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.