Electronic components mounting/connecting package and its fabrication method
US5336547A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 26, 1993 |
| Grant date | Aug 9, 1994 |
| Priority date | — |
| Expiry date | Feb 26, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/249986
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates to an electronic components mounting/connecting package characterized by using bump electrodes to connect electronic components such as semiconductors and the like with patterning electrodes of a circuit board. In order to prevent deterioration in connecting reliability due to deformation and the like of semiconductors and circuit boards, it is necessary to have some elasticity incorporated with bump electrodes. The composition of bump electrodes disclosed by the present invention is to have resin particles dispersed to high density in the metallic bump electrodes. According to this composition, even when there are some variations of distribution in circuit board warp and bump electrode height, it has become possible to absorb the variations through elasticity presented by the bump electrodes and to perform a low strain connection with a resultant enhancement in connecting reliability at high temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.