Inventor · Kyotanabe, JP

Tetsuo Kawakita

13Patents
11h-index
18Co-inventors
65Inventor score

Filing activity: Feb 26, 1993 → Jan 25, 2006

Most-cited inventions

PatentTitleAreaCited byStatus
US5477087A Bump electrode for connecting electronic components Electricity 109 Expired
US5734199A Semiconductor device having improved test electrodes Electricity 91 Expired
US5336547A Electronic components mounting/connecting package and its fabrication method Emerging Cross-Sectional Technologies 38 Expired
US6624473B1 Thin-film transistor, panel, and methods for producing them Electricity 29 Expired
US6506669B1 Method of fabricating a thin film transistor Physics 29 Expired
US5811351A Semiconductor device and method of manufacturing the same Electricity 27 Expired
US5952718A Semiconductor devices having protruding contacts Electricity 26 Expired
US6812490B2 Thin-film transistor, panel, and methods for producing them Electricity 18 Expired
US6331476A Thin film transistor and producing method thereof Electricity 16 Expired
US6534353B1 Method of fabricating a thin-film transistor Physics 14 Expired
US6107120A Method of making semiconductor devices having protruding contacts Electricity 12 Expired
US7306980B2 Method for fabricating thin film transistor Electricity 9 Expired
US7705536B2 Display device Electricity 7 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.