Fixture for testing mounting integrity of heat sinks on semiconductor packages, and method of testing
US5337614A · kind A · utility
9Cited by
9References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 20, 1992 |
| Grant date | Aug 16, 1994 |
| Priority date | — |
| Expiry date | Aug 20, 2012 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2203/0017
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A reliable, repeatable, well-characterized, safe technique for testing the mounting integrity of heat sinks adhered to semiconductor packages is disclosed. Generally, a semiconductor package is secured in a tensiometer, the heat sink is clamped and secured to the spindle of the tensiometer, and a stud-pull type test is conducted.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.