Catalytic electroless gold plating baths
US5338343A · kind A · utility
9Cited by
9References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 23, 1993 |
| Grant date | Aug 16, 1994 |
| Priority date | — |
| Expiry date | Jul 23, 2013 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/44
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electroless catalytic gold plating solution is disclosed comprising a water soluble organic thiol gold (I) complex, an alkali metal cyanide, an alkali metal hydroxide, a borohydride reducing agent, and may also contain a stabilizing agent. The electroless gold plating solution will deposit gold on a gold surface several times faster than the conventional electroless gold baths based on potassium aurous cyanide. The use of an organic thiol gold (I) complex eliminates the buildup of inhibitory cyanide ions as a result of replenishment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.