Method for manufacturing a laminated plate used in a semiconductor device
US5338392A · kind A · utility
1Cited by
3References
4Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 7, 1993 |
| Grant date | Aug 16, 1994 |
| Priority date | — |
| Expiry date | Oct 7, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/202
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In a method for manufacturing a laminated plate used in a semiconductor device according to the present invention, a conductive member is processed to form a frame and a wiring pattern supported by the frame integrally with each other, the wiring pattern is bonded to the major surface of a base member by high-temperature heating, using the frame as a guide, thereby to form a laminated layer, and the frame is removed from the laminated layer to form a desirable laminated plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.