Method for electroplating metal onto a non-conductive substrate treated with basic accelerating solutions for metal plating
US5342501A · kind A · utility
25Cited by
17References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 30, 1992 |
| Grant date | Aug 30, 1994 |
| Priority date | — |
| Expiry date | Oct 30, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S428/901
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Novel aqueous accelerating solutions and methods for their use in connection with metal plating of dielectric materials are disclosed and claimed. The accelerating solutions are mildly basic aqueous solutions including dilute concentrations of copper ions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.