Method of wet etching of polyimide
US5342736A · kind A · utility
1Cited by
3References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 16, 1992 |
| Grant date | Aug 30, 1994 |
| Priority date | — |
| Expiry date | Jan 16, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09845
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of wet etching of polyimide comprising the steps of PA1 (a) cleaning a substrate for coating; PA1 (b) coating a polyamic acid varnish onto said cleaned substrate; PA1 (c) thermal curing the varnish in (b) to form a polyimide layer on the substrate; PA1 (d) coating a polyamide-imide varnish onto the layer in (c); PA1 (e) curing the varnish in (d), PA1 (f) coating a layer of photoresist onto the coated substrate; PA1 (g) masked exposing; PA1 (h) image developing on said substrate; and PA1 (i) wet etching the unprotected portion in the layers of polyimide and polyamide-imide to form a staircase pattern on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.