Method and apparatus for thermally insulating a wafer support
US5343938A · kind A · utility
52Cited by
6References
22Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 24, 1992 |
| Grant date | Sep 6, 1994 |
| Priority date | — |
| Expiry date | Dec 24, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68785
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Apparatus and method for reducing heat transfer from a motor to a wafer in a spin-on coating apparatus. The interior of the wafer chuck or spindle is provided with a gap, chamber or void that is either evacuated or is filled with a selected gas or other thermal barrier having low thermal conductivity compared to the wafer chuck material or the spindle material. Optionally, the wafer chuck or the spindle may be provided with a plurality of apertures that allow the gas in the gap to flow to a region outside the wafer chuck or the spindle.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.