Integrated building and conveying structure for manufacturing under ultraclean conditions
US5344365A · kind A · utility
118Cited by
41References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 14, 1993 |
| Grant date | Sep 6, 1994 |
| Priority date | — |
| Expiry date | Sep 14, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67727
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A building houses a semiconductor manufacturing facility, which is circular in shape and is of a multi-story structure. A silo is located at the center for use in storing and transferring wafers to clean rooms disposed radially around the silo at each floor. Human access is not permitted in the silo and in the clean rooms in order to prevent contamination of the wafers. Due to the modularity of the clean room structures, clean rooms can be reconfigured easily without significant impact on the on-going manufacturing operation. The modularity also permits portions of the facility to be deactivated when not needed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.