Electronic package using closed pore composites
US5346751A · kind A · utility
5Cited by
9References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 14, 1991 |
| Grant date | Sep 13, 1994 |
| Priority date | — |
| Expiry date | May 14, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24999
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The electronic packages of the invention all employ the general materials scheme of a low dielectric constant material (low K material) mounted on a dense, high thermal conductivity (high TC) ceramic base. In this way, the low K material provides the signal transmission paths to and from the I.C. chips housed in the package and thus allows for higher signal transmission speed. The high TC material allows for heat dissipation out of the package. The dense base and/or the low K material may contain metallization in any desired pattern. The low K material is preferably a composite of closed pores in a glass-containing matrix.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.