Method for forming a flip-chip bond from a gold-tin eutectic
US5346857A · kind A · utility
57Cited by
7References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 28, 1992 |
| Grant date | Sep 13, 1994 |
| Priority date | — |
| Expiry date | Sep 28, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for flip-chip bonding an integrated circuit die to a substrate. A substrate (21) having conductive bonding areas (22) coated with tin (23) is secured to a bottom end effector of a flip-chip bonding apparatus. An integrated circuit die (26) having gold bumps (28) is secured to a die tool of the flip-chip bonding apparatus. A gold-tin eutectic bond is formed between the integrated circuit die (26) and the conductive bonding areas (22) of the substrate (21).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.